Method of forming a semiconductor device

ABSTRACT

Methods of forming a semiconductor device are provided. A method includes introducing impurities into a part of a semiconductor substrate at a first surface of the semiconductor substrate by ion implantation, the impurities being configured to absorb electromagnetic radiation of an energy smaller than a bandgap energy of the semiconductor substrate. The method further includes forming a semiconductor layer on the first surface of the semiconductor substrate. The method further includes irradiating the semiconductor substrate with electromagnetic radiation configured to be absorbed by the impurities and configured to generate local damage of a crystal lattice of the semiconductor substrate. The method further includes separating the semiconductor layer and the semiconductor substrate by thermal processing of the semiconductor substrate and the semiconductor layer, where the thermal processing is configured to cause crack formation along the local damage of the crystal lattice by thermo-mechanical stress.

BACKGROUND

Semiconductor processing technologies aim at a precise setting of awafer thickness. In insulated gate bipolar transistors (IGBTs) a precisesetting of a target distance between a field stop zone and an emitter isessential for ensuring high short-circuit current capability, forexample.

Therefore, it may be desirable to improve a method of manufacturing asemiconductor device by improving the setting of a semiconductor bodythickness of the semiconductor device.

SUMMARY

The present disclosure relates to a method of forming a semiconductordevice. The method includes introducing impurities into a part of asemiconductor substrate at a first surface of the semiconductorsubstrate by ion implantation, the impurities being configured to absorbelectromagnetic radiation of an energy smaller than a bandgap energy ofthe semiconductor substrate. The method further includes forming asemiconductor layer on the first surface of the semiconductor substrate.The method further comprises irradiating the semiconductor substratewith electromagnetic radiation configured to be absorbed by theimpurities and configured to generate a local damage of a crystallattice of the semiconductor substrate. The method further includesseparating the semiconductor layer and the semiconductor substrate bythermal processing of the semiconductor substrate and the semiconductorlayer, the thermal processing configured to cause crack formation alongthe local damage of the crystal lattice by thermo-mechanical stress.

The present disclosure relates to another method of forming asemiconductor device. The method includes forming a semiconductor layeron the first surface of a semiconductor substrate, wherein impuritiesare introduced into a first sub-layer adjoining the semiconductorsubstrate at a first surface of the semiconductor substrate, theimpurities being configured to absorb electromagnetic radiation of anenergy smaller than a bandgap energy of the semiconductor substrate. Themethod further includes irradiating the semiconductor substrate withelectromagnetic radiation configured to be absorbed by the impuritiesand configured to generate a local damage of a crystal lattice of thesemiconductor substrate. The method further includes separating thesemiconductor layer and the semiconductor substrate by thermalprocessing of the semiconductor substrate and the semiconductor layer,the thermal processing configured to cause crack formation along thelocal damage of the crystal lattice by thermo-mechanical stress.

Those skilled in the art will recognize additional features andadvantages upon reading the following detailed description and uponviewing the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification. The drawings illustrate one or moreembodiments and, together with the description, serve to explainprinciples of the invention. Other embodiments of the invention andintended advantages will be readily appreciated as they become betterunderstood by reference to the following detailed description.

FIG. 1 is a schematic flow diagram for illustrating a method ofmanufacturing a semiconductor device according to one or moreembodiments;

FIG. 2 is a schematic flow diagram for illustrating another method ofmanufacturing a semiconductor device according to one or moreembodiments;

FIGS. 3A to 3G are cross-sectional views of a semiconductor body forillustrating processes of a method of manufacturing a semiconductordevice according to one or more embodiments;

FIG. 4 is a cross-sectional view of a semiconductor body forillustrating a process that may replace the process of FIG. 3C accordingto one or more embodiments;

FIGS. 5A to 5C are cross-sectional views of a semiconductor body forillustrating processes that may follow the processes of FIGS. 3A to 3Daccording to one or more embodiments;

FIGS. 6A and 6B are cross-sectional views of a semiconductor body forillustrating processes that may follow the processes of FIGS. 3A to 3Caccording to one or more embodiments;

FIG. 6C is a schematic cross-sectional view of a semiconductor body forillustrating another method of manufacturing a semiconductor deviceaccording to one or more embodiments; and

FIGS. 7A to 7D are schematic cross-sectional views of a semiconductorbody for illustrating semiconductor devices manufactured by processes ofFIGS. 1 to 6B according to one or more embodiments.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof, and in which are shownby way of illustrations specific embodiments in which the disclosure maybe practiced. It is to be understood that other embodiments may beutilized and structural or logical changes may be made without departingfrom the scope of the present invention. For example, featuresillustrated or described for one embodiment can be used on or inconjunction with other embodiments to yield yet a further embodiment. Itis intended that the present disclosure includes such modifications andvariations. The examples are described using specific language thatshould not be construed as limiting the scope of the appending claims.The drawings are not scaled and are for illustrative purposes only. Forclarity, the same elements have been designated by correspondingreferences in the different drawings if not stated otherwise.

The terms “having”, “containing”, “including”, “comprising” and the likeare open and the terms indicate the presence of stated structures,elements or features but not preclude the presence of additionalelements or features. The articles “a”, “an” and “the” are intended toinclude the plural as well as the singular, unless the context clearlyindicates otherwise.

The term “electrically connected” describes a permanent low-ohmicconnection between electrically connected elements, for example a directcontact between the concerned elements or a low-ohmic connection via ametal and/or highly doped semiconductor. The term “electrically coupled”includes that one or more intervening element(s) adapted for signaltransmission may exist between the electrically coupled elements, forexample elements that temporarily provide a low-ohmic connection in afirst state and a high-ohmic electric decoupling in a second state.

The figures illustrate relative doping concentrations by indicating “−”or “+” next to the doping type “n” or “p”. For example, “n⁻” means adoping concentration that is lower than the doping concentration of an“n”-doping region while an “n⁺”-doping region has a higher dopingconcentration than an “n”-doping region. Doping regions of the samerelative doping concentration do not necessarily have the same absolutedoping concentration. For example, two different “n”-doping regions mayhave the same or different absolute doping concentrations.

The terms “wafer”, “substrate”, “semiconductor body” or “semiconductorsubstrate” used in the following description may include anysemiconductor-based structure that has a semiconductor surface. Waferand structure are to be understood to include silicon (Si),silicon-on-insulator (SOI), silicon-on sapphire (SOS), doped and undopedsemiconductors, epitaxial layers of silicon supported by a basesemiconductor foundation, and other semiconductor structures. As atypical base material for manufacturing a variety of such semiconductordevices, silicon wafers grown by the Czochralski (CZ) method, e.g. bythe standard CZ method or by the magnetic CZ (MCZ) method or by theContinuous CZ (CCZ) method may be used. Also FZ (Float-Zone) siliconwafers may be used. The semiconductor need not be silicon-based. Thesemiconductor could as well be silicon germanium (SiGe), germanium (Ge)or gallium arsenide (GaAs). According to other embodiments, siliconcarbide (SiC) or gallium nitride (GaN) may form the semiconductorsubstrate material.

The term “horizontal” as used in this specification intends to describean orientation substantially parallel to a first or main surface of asemiconductor substrate or body. This can be for instance the surface ofa wafer or a semiconductor die.

The term “vertical” as used in this specification intends to describe anorientation which is substantially arranged perpendicular to the firstsurface, i.e. parallel to the normal direction of the first surface ofthe semiconductor substrate or body.

In this specification, a second surface of a semiconductor substrate orsemiconductor body is considered to be formed by the lower or backsideor rear surface while the first surface is considered to be formed bythe upper, front or main surface of the semiconductor substrate. Theterms “above” and “below” as used in this specification thereforedescribe a relative location of a structural feature to another.

In this specification, embodiments are illustrated including p- andn-doped semiconductor regions. Alternatively, the semiconductor devicescan be formed with opposite doping relations so that the illustratedp-doped regions are n-doped and the illustrated n-doped regions arep-doped.

The semiconductor device may have terminal contacts such as contact pads(or electrodes) which allow electrical contact to be made with theintegrated circuit or discrete semiconductor device included in thesemiconductor body. The electrodes may include one or more electrodemetal layers which are applied to the semiconductor material of thesemiconductor chips. The electrode metal layers may be manufactured withany desired geometric shape and any desired material composition. Theelectrode metal layers may, for example, be in the form of a layercovering an area. Any desired metal, for example Cu, Ni, Sn, Au, Ag, Pt,Pd, Al, Ti, Ta, W, Ru, Mo and an alloy of one or more of these metalsmay be used as the material. The electrode metal layer(s) need not behomogenous or manufactured from just one material, that is to sayvarious compositions and concentrations of the materials contained inthe electrode metal layer(s) are possible. As an example, the electrodelayers may be dimensioned large enough to be bonded with a wire.

In embodiments disclosed herein one or more conductive layers, inparticular electrically conductive layers, are applied. It should beappreciated that any such terms as “formed” or “applied” are meant tocover literally all kinds and techniques of applying layers. Inparticular, they are meant to cover techniques in which layers areapplied at once as a whole like, for example, laminating techniques aswell as techniques in which layers are deposited in a sequential mannerlike, for example, sputtering, plating (electroless or electrochemical),molding, Chemical Vapor Deposition (CVD), physical vapor deposition(PVD), evaporation, hybrid physical-chemical vapor deposition (HPCVD),printing etc.

The applied conductive layer may comprise, inter alia, one or more of alayer of metal such as Al, Cu or Sn or an alloy thereof, a layer of aconductive paste and a layer of a bond material. The layer of a metalmay be a homogeneous layer. The conductive paste may include metalparticles distributed in a vaporizable or curable polymer material,wherein the paste may be fluid, viscous or waxy. The bond material maybe applied to electrically and mechanically connect the semiconductorchip, e.g., to a carrier or, e.g., to a contact clip. A soft soldermaterial or, in particular, a solder material capable of formingdiffusion solder bonds may be used, for example solder materialcomprising one or more of Sn, SnAg, SnAu, SnCu, In, InAg, InCu and InAu.

A dicing process may be used to divide the wafer into individual chips.Any technique for dicing may be applied, e.g., blade dicing (sawing),laser dicing, etching, etc. The semiconductor body, for example asemiconductor wafer may be diced by applying the semiconductor wafer ona tape, in particular a dicing tape, apply the dicing pattern, in e.g.particular a rectangular pattern, to the semiconductor wafer, e.g.,according to one or more of the above mentioned techniques, optionallycarry out a grinding process, and then pull the tape, e.g., along fourorthogonal directions in the plane of the tape. By pulling the tape, thesemiconductor wafer gets divided into a plurality of semiconductor dies(chips).

FIG. 1 is a schematic flow diagram for illustrating a method 100 ofmanufacturing a semiconductor device.

It will be appreciated that while method 100 is illustrated anddescribed below as a series of acts or events, the illustrated orderingof such acts or events are not to be interpreted in a limiting sense.For example, some acts may occur in different orders and/or concurrentlywith other acts or events apart from those illustrated and/or describedherein. In addition, not all illustrated acts may be required toimplement one or more aspects of embodiments of the disclosure herein.Also, one or more of the acts depicted herein may be carried out in oneor more separate act and/or phases.

Process feature S100 comprises introducing impurities into a part of asemiconductor substrate at a first surface of the semiconductorsubstrate by ion implantation, the impurities being configured to absorbelectromagnetic radiation of an energy smaller than a bandgap energy ofthe semiconductor substrate. In some embodiments, the impurities aredeep impurities requiring energies larger than three times the thermalenergy at room temperature to ionize. For example, the deep impuritiesmay have a distance to the bandgap of more than 100 meV, or even morethan 150 meV. For a semiconductor substrate made of silicon, theimpurities may be selected from the group of nitrogen (N), molybdenum(Mo), tungsten (W), tantalum (Ta), indium, or any combination thereof.For a semiconductor substrate made of silicon carbide, the impuritiesmay be selected from the group of titanium (Ti), tantalum (Ta) andvanadium (V) or any combination thereof. In some embodiments, anextension of the impurities along a vertical direction between oppositesurfaces of the semiconductor substrate is in a range of 100 nm to 3 μm.In some embodiments, a dose of the impurities is in a range of 1×10¹³cm⁻² to a crystal lattice amorphisation dose.

Process feature S110 comprises forming a semiconductor layer on thefirst surface of the semiconductor substrate. The semiconductor layermay be formed by an epitaxial layer formation process, for example by achemical vapor deposition (CVD) process. The semiconductor layer mayinclude one or more sub-layers subsequently formed on each other. Dopingof the semiconductor layer or of the semiconductor sub-layers may becarried out in-situ during layer deposition/growth or be carried out byion implantation and/or diffusion from a diffusion source. By way ofexample, when forming a super-junction structure in the semiconductorlayer, the so-called multi-epitaxial growth technique may be appliedwhere epitaxial growth of sub-layers and masked ion implantations arerepeated alternately until a certain drift-layer thickness is achieved.During the epitaxial process the previously implanted species may beincorporated in the crystal lattice of the semiconductor substrate andoccupy the desired energy level within the band gap.

Process feature S120 comprises irradiating the semiconductor substratewith electromagnetic radiation configured to be absorbed by theimpurities and configured to generate a local damage of a crystallattice of the semiconductor substrate. The local damage of the crystallattice is caused by the local heating of the crystal lattice due toabsorption of the electromagnetic radiation that may lead to a localweakening and/or modification of the crystal lattice, for examplemicro-cracks. The local damage is a crack-initiating area having afracture strength that is locally reduced at or around the impuritiescompared to un-damaged parts of the semiconductor layer or semiconductorsubstrate. The impurities causing the local damage by absorption of theradiation are vertically self-aligned with respect to the semiconductorlayer and irradiation of the semiconductor layer may also be carried outwithout focusing the irradiation beam at a certain plane within thesemiconductor layer/semiconductor substrate. In some embodiments, theelectromagnetic radiation is laser light. An energy density ofelectromagnetic radiation may be adapted to the absorption behavior ofthe impurities and set high enough, for example by intensity andduration of radiation, to a value within a range of 1 J/cm² and 5 J/cm².In some embodiments, radiation is incident on a surface of thesemiconductor layer. Low doping of the semiconductor layer may bebeneficial in regard to suppression or reduction of undesired absorptionof the radiation through the semiconductor layer. In addition to or asan alternative to radiation incident on a surface of the semiconductorlayer, the radiation may also be incident on a surface of thesemiconductor substrate opposite to a surface where the semiconductorlayer is located. Low doping of the semiconductor substrate, for examplesubstrate doping concentrations smaller than 10¹⁴ cm⁻³, thinning of thesemiconductor substrate prior to radiation by mechanical and/or chemicalprocesses such as machining, etching, cleaning, plasma treatment, andusage of undoped and/or semi-insulating substrates may be beneficial inregard to suppression or reduction of undesired absorption of theradiation through the semiconductor substrate.

Process feature S130 comprises separating the semiconductor layer andthe semiconductor substrate by thermal processing of the semiconductorsubstrate and the semiconductor layer, where the thermal processing isconfigured to cause crack formation along the local damage of thecrystal lattice by thermo-mechanical stress. Introduction of thethermo-mechanical stress may be based on expansion coefficientdifferences of a semiconductor material and another material formed onthe first or the opposite surface of the semiconductor material. Oneexample is known as the so-called “Cold Split” process utilizing apolymer coating on the surfaces of the semiconductor material followedby a pre-cooling and cooling process for introducing thethermo-mechanical stress. This causes a crack to expand from the localdamage in the crack-initiating area along a cracking line, and leads tothe separation of the semiconductor layer and the semiconductorsubstrate by splitting.

FIG. 2 is a schematic flow diagram for illustrating a method 200 ofmanufacturing a semiconductor device.

It will be appreciated that while method 200 is illustrated anddescribed below as a series of acts or events, the illustrated orderingof such acts or events are not to be interpreted in a limiting sense.For example, some acts may occur in different orders and/or concurrentlywith other acts or events apart from those illustrated and/or describedherein. In addition, not all illustrated acts may be required toimplement one or more aspects of embodiments of the disclosure herein.Also, one or more of the acts depicted herein may be carried out in oneor more separate act and/or phases. Also, one or more of the actsdepicted herein may be carried out in one or more separate act and/orphases. Details on process features S100, S110, S120, S130, applylikewise to process features S200, S210, S220 below.

Process feature S200 comprises forming a semiconductor layer on thefirst surface of a semiconductor substrate, wherein impurities areintroduced into a first sub-layer adjoining the semiconductor substrateat a first surface of the semiconductor substrate, the impurities beingconfigured to absorb electromagnetic radiation of an energy smaller thana bandgap energy of the semiconductor substrate. Other than processfeature S100 depicted in FIG. 1, the impurities are introduced into aseeding layer and/or lower or lowermost layer of a functionalsemiconductor layer grown on the semiconductor substrate. The functionalsemiconductor layer may act as a drift zone of a semiconductor deviceformed therein, for example.

Process feature S210 comprises irradiating the semiconductor substratewith electromagnetic radiation configured to be absorbed by theimpurities and configured to generate a local damage of a crystallattice of the semiconductor substrate.

Process feature S220 comprises separating the semiconductor layer andthe semiconductor substrate by thermal processing of the semiconductorsubstrate and the semiconductor layer, the thermal processing configuredto cause crack formation along the local damage of the crystal latticeby thermo-mechanical stress.

The processes depicted in FIGS. 1 and 2 allow for a local damage ofcrystal lattice that is self-aligned along a vertical direction withrespect to a semiconductor layer that is to be separated from asemiconductor substrate. The processes depicted in FIGS. 1 and 2supersede focusing of the radiation to a reference plane and overcomemisadjustment of the radiation caused by wafer-bow.

In some embodiments, the method further comprises, prior to separatingthe semiconductor layer and the semiconductor substrate by thermalprocessing or prior to irradiating the semiconductor substrate withelectromagnetic radiation, forming semiconductor device elements inand/or on the semiconductor layer. The device elements may includesemiconducting regions, for example p- and/or n-doped regions dopedregions, insulating layers, for example gate and/or field dielectric(s)and/or interlayer dielectric(s) and conducting layers such as metallayer(s) for contacts and/or wirings, protection and/or passivationlayer(s) such as imide. The semiconductor regions, for example a dopeddrain region, a doped source region, a doped body region, a doped anoderegion, a doped cathode region may be formed at the first surface by ionimplantation and/or diffusion from a diffusion source, for example. Aplanar gate structure including a gate dielectric and a gate electrodeor a gate structure including a gate dielectric and a gate electrode ina trench may be formed by thermal oxidation and/or layer deposition ofthe gate dielectric and layer deposition of a highly dopedsemiconductor, for example polycrystalline silicon and/or metallayer(s). Thus, processing of the semiconductor device at a surface ofthe semiconductor layer, for example a front surface of thesemiconductor device, may be completed before separating thesemiconductor layer and the semiconductor substrate by thermalprocessing. Thus, mechanical stability of a semiconductor bodycomprising the semiconductor layer and the semiconductor substrate maybe utilized during wafer handling when processing the semiconductorelements at a surface of the semiconductor layer.

In some embodiments, the method further comprises maintaining theimpurities as a recombination zone of the semiconductor device.

In some embodiments, the method further comprises reducing a thicknessof the semiconductor substrate by removal of material of thesemiconductor substrate prior to irradiating the semiconductor substratewith electromagnetic radiation configured to be absorbed by theimpurities and configured to generate a local damage of a crystallattice of the semiconductor substrate. Material removal for thinningthe semiconductor substrate may be based on mechanical and/or chemicalprocesses, for example one or more of machining, etching, cleaning,plasma treatment, chemical mechanical polishing (CMP). Thereby,absorption of subsequent radiation in the semiconductor substrate may bereduced.

In some embodiments, forming the semiconductor layer comprises forming acontact or emitter layer on a semiconductor region comprising theimpurities, and forming a drift zone layer on the doped contact oremitter layer. A maximum doping concentration of the contact or emitterlayer exceeds a maximum doping concentration of the drift zone layer bymore than two orders of magnitude. The doped contact or emitter layermay be electrically connected at a rear side of the semiconductor layerafter separation of the semiconductor layer and the semiconductorsubstrate by thermal processing, whereas gate and source regions may beelectrically connected at a front side of the semiconductor layeropposite to the rear side. Thus, rear side contact or emitter processingis carried out prior to separation of the semiconductor layer and thesemiconductor substrate. As an example, the doped contact or emitterlayer may be formed on a seed layer for epitaxial growth on thesemiconductor substrate.

In some embodiments, the method further comprises, after separating thesemiconductor layer and the semiconductor substrate, forming a dopedcontact or emitter layer at a surface of the semiconductor layer exposedby separating the semiconductor layer and the semiconductor substrate.The doped contact or emitter layer may be formed by an ion implantationprocess in combination with a low temperature annealing process and/or alaser annealing process, for example.

In some embodiments, the method further comprises, after separating thesemiconductor layer and the semiconductor substrate by thermalprocessing, preparing a surface of the semiconductor substrate exposedby the separation process for reuse as a base substrate. Examples ofsurface preparation include chemical and/or mechanical processes, forexample polishing, chemical mechanical polishing (CMP) and/or chemicalsurface cleaning process(es).

In some embodiments, the method further comprises, prior to separatingthe semiconductor layer and the semiconductor substrate, mounting thesemiconductor layer on a carrier. Thereby, mechanical stability offurther processes after separation of the semiconductor layer and thesemiconductor substrate can be improved.

FIGS. 3A to 3G are cross-sectional views of a semiconductor body forillustrating processes of a method of manufacturing a semiconductordevice as depicted in FIG. 1 and/or FIG. 2. Details on process featuresdescribed with reference to FIGS. 1 and 2 apply likewise.

Referring to the schematic cross-sectional view of FIG. 3A, impuritiesare introduced into a surface part of a semiconductor substrate 101 byion implantation exemplified by arrows, the impurities being configuredto absorb electromagnetic radiation of an energy smaller than a bandgapenergy of the semiconductor substrate. The impurities are exemplified bysymbol “x” in the surface part of the semiconductor substrate 101. Theimpurities may be introduced only into a part of a surface area of thesemiconductor substrate 101, for example. By way of example, theimpurities may be introduced into an inner portion of a surface area ofthe semiconductor substrate 101 leaving an outer portion such as a ringportion free of impurities. In some other embodiments, the impuritiesare introduced into an overall surface area of the semiconductorsubstrate 101.

Referring to the schematic cross-sectional view of FIG. 3B, asemiconductor layer 103 is formed on the surface part of thesemiconductor substrate 101, for example by an epitaxial growth process.The semiconductor layer 103 may comprise one or a plurality ofsub-layers, for example a seeding layer 1030 and a functionalsemiconductor layer such as a drift zone layer 1031. Between the seedinglayer 1030 and the drift zone layer 1031, additional functional layerssuch as a doped contact or emitter layer and/or a doped field stop zonelayer may be arranged.

Referring to the schematic cross-sectional view of FIG. 3C, thesemiconductor substrate 101 is irradiated with electromagnetic radiation105 configured to be absorbed by the impurities and configured togenerate a local damage of a crystal lattice of the semiconductorsubstrate. The radiation is incident on an exposed surface of thesemiconductor layer 103. A boundary of an area of the local damage ofthe crystal lattice is illustrated by a dashed line 107 surrounding theimpurities.

Referring to the schematic cross-sectional view of FIG. 3D, thesemiconductor layer 103 is processed at an exposed surface by formationof semiconductor device elements as described above. The semiconductordevice elements may be formed within or above the semiconductor layer103 in an area 109.

Referring to the schematic cross-sectional view of FIG. 3E, thesemiconductor layer and the semiconductor substrate are separated bythermal processing of the semiconductor substrate and the semiconductorlayer as described with reference to FIGS. 1 and 2. Depending upon amechanical stability of the separated semiconductor layer 103, forexample a thickness of the separated semiconductor layer 103, thesemiconductor layer 103 may be mounted to a carrier 111 via the area 109comprising the semiconductor device elements.

Referring to the schematic cross-sectional view of FIG. 3F, thesemiconductor layer 103 is prepared at a surface exposed by theseparation process. Preparation may include processes of cleaning,etching and machining, for example grinding and/or polishing removingthe impurities and the seed layer 1030, for example. In someembodiments, the impurities and seed layer may remain as functionalelements of the semiconductor device, for example as a recombinationzone, for example.

Referring to the schematic cross-sectional view of FIG. 3G, processes offorming doped semiconductor layer(s) 114 and contact layer(s) 115 at theexposed surface of the semiconductor layer 103 may follow. The dopedsemiconductor layer(s) may be one or more of a highly doped contactlayer, an emitter layer, a field stop zone layer, for example. Thecontact layer(s) 115 may include one or more conductive layers such asmetal layers or metal alloy layers or any combination thereof. Formationof all or part of the doped semiconductor layer(s) 114 may be omitted ifthese layers have been formed beforehand during formation of thesemiconductor layer as depicted in FIG. 3B.

In another embodiment, the process of irradiating the semiconductorsubstrate 101 with electromagnetic radiation 105 is different from theprocess depicted in FIG. 3C in that the electromagnetic radiation 105 isincident on an exposed surface of the semiconductor substrate 101 asillustrated in the schematic cross-sectional view of FIG. 4.

In another embodiment of a method of manufacturing a semiconductordevice, the processes depicted in FIGS. 3A to 3D are followed byprocesses as described below with reference to FIGS. 5A to 5C.

Referring to the schematic cross-sectional view of FIG. 5A, a ringstructure 117 is cut in the semiconductor substrate from an exposedsurface up to the impurities. The ring structure 117 may be cut by oneor more of blade dicing (sawing), laser dicing, etching, for example. Asan alternative and/or in addition to cutting of the ring structure 117,a grinding process may be applied to remove part of the semiconductorsubstrate within the ring structure, thereby reducing undesiredparasitic absorption of the electromagnetic radiation 105 duringsubsequent radiation.

Referring to the schematic cross-sectional view of FIG. 5B, theelectromagnetic radiation 105 is incident on an exposed surface of thesemiconductor substrate 101 in an area inside of the ring structure 117.A boundary of an area of the local damage of the crystal lattice isillustrated by the dashed line 107 surrounding the impuritiesschematically depicted by “x”.

Referring to the schematic cross-sectional view of FIG. 5C, thesemiconductor layer 103 and a part of the semiconductor substrate 101inside of the ring structure 117 are separated by thermal processing ofthe semiconductor substrate 101 and the semiconductor layer 103 asdescribed with reference to FIGS. 1 and 2. A part of the semiconductorsubstrate 101 outside the ring structure 117 remains as a semiconductorsubstrate ring providing mechanical stability for further processes.Examples of further processes include processes of cleaning, etching andmachining the exposed surface of the semiconductor substrate, forexample grinding and/or polishing removing the impurities and the seedlayer 1030, forming doped semiconductor layer(s) and contact layer(s) atthe exposed surface of the semiconductor substrate 101. The dopedsemiconductor layer(s) may be one or more of a highly doped contactlayer, an emitter layer, a field stop zone layer, for example. Thecontact layer(s) may include one or more conductive layers such as metallayers or metal alloy layers or any combination thereof. Formation ofall or part of the doped semiconductor layer(s) may be omitted if theselayers have been formed beforehand during formation of the semiconductorlayer as depicted in FIG. 3B. A recess caused by removal of the part ofthe semiconductor substrate 101 inside the ring structure 117 may befilled with a conductive material, for example highly dopedsemiconductor material and/or metal for improving mechanical stabilityand electric contact to the semiconductor layer 103. In someembodiments, the part of the semiconductor substrate 101 outside thering structure 117 may be removed prior to applying the semiconductorwafer on a tape. Removal of the part of the semiconductor substrate 101outside the ring structure 117 may be carried out by a separationprocess as described with reference to FIGS. 1 and 2, i.e. byintroducing impurities into the semiconductor substrate outside the ringstructure 117 and by separating that part from the semiconductor layerby the separation process described with reference to FIGS. 1 and 2.

In another embodiment of a method of manufacturing a semiconductordevice, the processes depicted in FIGS. 3A to 3C are followed byprocesses as described below with reference to FIGS. 6A to 6C.

Referring to the schematic cross-sectional view of FIG. 6A, thesemiconductor layer 103 and the semiconductor substrate 101 areseparated by thermal processing of the semiconductor substrate and thesemiconductor layer as described with reference to FIGS. 1 and 2. Acarrier for mechanical stability may be omitted in case the separatedsemiconductor layer provides sufficient mechanical stability. Thisallows for more flexible process technology since a rear side of thesemiconductor device may be processed at any time and does not sufferfrom possible constraints of pre-determined processing sequences to meetthe thermal budgets required for each process.

Referring to the schematic cross-sectional view of FIG. 6B, thesemiconductor layer 103 is prepared at a surface exposed by theseparation process. Preparation may include processes of cleaning,etching and machining, for example grinding and/or polishing removingthe impurities and the seed layer 1030, for example. In someembodiments, the impurities and seed layer may remain as functionalelements of the semiconductor device, for example as a recombinationzone, for example. Processes of forming the doped semiconductor layer(s)114 and the contact layer(s) 115 at the exposed surface of thesemiconductor layer 103 may follow. The doped semiconductor layer(s) maybe one or more of a highly doped contact layer, an emitter layer, afield stop zone layer, for example. The contact layer(s) 115 may includeone or more conductive layers such as metal layers or metal alloy layersor any combination thereof. Formation of all or part of the dopedsemiconductor layer(s) 114 may be omitted if these layers have beenformed beforehand during formation of the semiconductor layer asdepicted in FIG. 3B. Processing at a surface opposite to the surfaceexposed by the separation process may be carried out before, and/oralternately, and/or after processing at the surface exposed by theseparation process. Processing at a surface opposite to the surfaceexposed by the separation process may include formation of semiconductordevice elements as described above. The semiconductor device elementsmay be formed within or above the semiconductor layer 103 in the area109.

In the embodiments illustrated in FIGS. 3A to 6B, the impurities areintroduced into a surface area of the semiconductor substrate. Accordingto another embodiment, the impurities may be introduced into a lower orlowermost sub-layer of the semiconductor body 103, for example into theseeding layer 1030, see cross-sectional view of FIG. 6C, or into anyother sub-layer between the drift zone layer 1031 and the semiconductorsubstrate 101. Other processes illustrated in FIGS. 3A to 6B applylikewise.

The methods of forming semiconductor devices as depicted in FIGS. 1 to6C may result in semiconductor devices as described with reference toFIGS. 7A to 7D below.

FIG. 7A is a schematic cross-sectional view 7001 of a portion of avertical semiconductor device according to an embodiment. The verticalsemiconductor device comprises a semiconductor body 704, for example asilicon semiconductor body or a silicon carbide semiconductor body.Precise adjustment of a thickness d₁ of a drift zone of thesemiconductor body 704 includes process features described above withreference to FIGS. 1 to 6C.

The vertical semiconductor device includes a first load terminalstructure 720 at a first surface 707, e.g. front surface of thesemiconductor body 704. The first load terminal structure 720 includesdoped semiconductor region(s). The doped semiconductor region(s) may beformed by doping processes of the semiconductor body 704 at the firstsurface 707, e.g. by diffusion and/or ion implantation processes. Thedoped semiconductor region(s) in the semiconductor body 704 of the firstload terminal structure 720 may include doped source and body regions ofa vertical power insulated gate field-effect transistors (IGFET), forexample a superjunction field-effect transistors (FET) or of a collectorof an insulated-gate bipolar transistor (IGBT), or of an anode orcathode region of a vertical power semiconductor diode or thyristor, forexample. In the course of processing the semiconductor body 704 at thefirst surface 707, depending on the power semiconductor device to beformed in the semiconductor body, a control terminal structure such as aplanar gate structure and/or a trench gate structure including gatedielectric(s) and gate electrode(s) may be formed.

The vertical semiconductor device further includes a second loadterminal structure 725 at a second surface 708, e.g. a rear surface ofthe semiconductor body 704 opposite to the first surface 707. The secondload terminal structure 725 includes doped semiconductor region(s). Thedoped semiconductor region(s) may be formed by doping processes of thesemiconductor body 704 at the second surface 708, e.g. by diffusionand/or ion implantation processes. The doped semiconductor region(s) inthe semiconductor body 704 of the second load terminal structure 725 mayinclude doped field stop region(s), doped drain regions of a verticalpower FET, or an emitter of an IGBT, or an anode or cathode region of avertical power semiconductor diode, for example. The implanted ions maybe “activated”, i.e. incorporated into the crystal lattice in region 725by a thermal annealing step (e.g. melting or non-melting laser annealingfrom the back surface after implantation).

A first electrical load terminal contact L1 to the first load terminalstructure 720 and an electrical control terminal contact C to a controlterminal structure, if present in the vertical power semiconductordevice, are part(s) of a wiring area above the first surface 707. Asecond electrical load contact L2 to the second load terminal structure725 is provided at the second surface 708. The electrical load contactsL1, L2 and the electrical control terminal contact C may be formed ofone or a plurality of patterned conductive layers such as metallizationlayers electrically isolated by interlevel dielectric layer(s)sandwiched between. Contact openings in the interlevel dielectriclayer(s) may be filled with conductive material(s) to provide electricalcontact between the one or the plurality of patterned conductive layersand/or active area(s) in the silicon semiconductor body such as thefirst load terminal structure 720, for example. The patterned conductivelayer(s) and interlevel dielectric layer(s) may form the wiring areaabove the semiconductor body 704 at the first surface 707, for example.A conductive layer, e.g. a metallization layer or metallization layerstack may be provided at the second surface 708, for example.

In the vertical semiconductor device illustrated in FIG. 7A, a currentflow direction is between the first and second load terminal contactsL1, L2 along a vertical direction between the opposite first and secondsurfaces 707, 708.

FIG. 7B is a schematic cross-sectional view 7002 of a portion of alateral semiconductor device according to an embodiment. The lateralsemiconductor device differs from the vertical semiconductor device inthat the second load terminal structure 725 and the second load terminalcontact L2 are formed at the first surface 707. The first and secondload terminal structures 720, 725 may be formed simultaneously by sameprocesses. Likewise, the first and second load terminal contacts L1, L2may be formed simultaneously by same processes.

In the embodiments illustrated in FIGS. 7A and 7B, a blocking voltagecapability of the vertical and lateral semiconductor devices can beadjusted by appropriate distances d1, d2 of a drift or base zone 705between the first and second load terminal structures 720, 725, forexample between a body region and a drain region of a FET.

In the schematic cross-sectional view 7003 of FIG. 7C, the semiconductordevice manufactured based on the processes illustrated in FIGS. 1 to 6Cis a planar gate transistor comprising a p-doped body region 730, ap⁺-doped body contact region 731 and an n⁺-doped source region 732. Agate dielectric 733 electrically isolates a gate electrode 734 from thedrift or base zone 705. The gate electrode 734 is electrically connectedto the control terminal contact C. In some embodiments, the gateelectrode 734 corresponds to the control terminal contact C. The firstload terminal contact L1, for example an emitter terminal contact iselectrically connected to the p-doped body region 730 and to then⁺-doped source region 732. A highly doped region 738, for example ap⁺-doped bipolar injection region of an IGBT or an n⁺-doped draincontact region of an IGFET at the second surface 708 is electricallyconnected to the second load terminal contact L2, for example acollector terminal contact.

In the schematic cross-sectional view 7004 of FIG. 7D, the semiconductordevice manufactured based on the processes illustrated in FIGS. 1 to 6Cis a trench gate transistor comprising a p-doped body region 750, ap⁺-doped body contact region 751 and an n⁺-doped source region 752. Agate dielectric 753 in a trench 756 electrically isolates a gateelectrode 754 from the drift or base zone 705. The gate electrode 754 iselectrically connected to the control terminal contact C. In someembodiments, the gate electrode 754 corresponds to the control terminalcontact C. The first load terminal contact L1, for example a sourceterminal contact is electrically connected to the p-doped body region750 and to the n⁺-doped source region 752. The highly doped region 738,for example a p⁺-doped bipolar injection region of an IGBT or ann⁺-doped drain contact region of an IGFET at the second surface 708 iselectrically connected to the second load terminal contact L2, forexample a collector terminal contact. In addition to the gate dielectric753 and the gate electrode 754, one or more field dielectric(s) andfield electrode(s) may be arranged in the trench 756, for examplebetween the gate electrode 754 and a bottom side of the trench.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat a variety of alternate and/or equivalent implementations may besubstituted for the specific embodiments shown and described withoutdeparting from the scope of the present invention. This application isintended to cover any adaptations or variations of the specificembodiments discussed herein. Therefore, it is intended that thisinvention be limited only by the claims and the equivalents thereof.

What is claimed is:
 1. A method of forming a semiconductor device, themethod comprising: forming a semiconductor layer on a first surface of asemiconductor substrate, wherein impurities are introduced into a firstsub-layer adjoining the semiconductor substrate at the first surface ofthe semiconductor substrate, the impurities being configured to absorbelectromagnetic radiation of an energy smaller than a bandgap energy ofthe semiconductor substrate; irradiating the semiconductor substratewith electromagnetic radiation, the electromagnetic radiation beingabsorbed by the impurities thereby generating a local damage of acrystal lattice of the semiconductor substrate; and subsequent to andindependent from irradiating the semiconductor substrate with theelectromagnetic radiation, applying thermal processing to thesemiconductor substrate and the semiconductor layer, including at thelocal damage, to regulate a temperature thereof, wherein the thermalprocessing is configured to cause a crack formation along the localdamage of the crystal lattice by thermo-mechanical stress; andseparating the semiconductor layer and the semiconductor substrate bythe thermal processing of the semiconductor substrate and thesemiconductor layer.
 2. A method of forming a semiconductor device, themethod comprising: introducing impurities into a part of a semiconductorsubstrate at a first surface of the semiconductor substrate by ionimplantation, the impurities being configured to absorb electromagneticradiation of an energy smaller than a bandgap energy of thesemiconductor substrate; forming a semiconductor layer on the firstsurface of the semiconductor substrate; irradiating the semiconductorsubstrate with electromagnetic radiation, the electromagnetic radiationbeing absorbed by the impurities thereby generating a local damage of acrystal lattice of the semiconductor substrate; and subsequent to andindependent from irradiating the semiconductor substrate with theelectromagnetic radiation, applying thermal processing to thesemiconductor substrate and the semiconductor layer, including at thelocal damage, to regulate a temperature thereof, wherein the thermalprocessing is configured to cause a crack formation along the localdamage of the crystal lattice by thermo-mechanical stress; andseparating the semiconductor layer and the semiconductor substrate bythe thermal processing of the semiconductor substrate and thesemiconductor layer.
 3. The method of claim 2, wherein theelectromagnetic radiation is laser light.
 4. The method of claim 2,wherein an energy density of the electromagnetic radiation is in a rangeof 1 J/cm2 and 5 J/cm2.
 5. The method of claim 2, wherein an extensionof the impurities along a vertical direction between opposite surfacesof the semiconductor substrate is in a range of 100 nm to 3 μm.
 6. Themethod of claim 2, wherein a dose of the impurities is in a range of1×1013 cm-2 to a crystal lattice amorphisation dose.
 7. The method ofclaim 2, wherein the semiconductor layer is a silicon semiconductorlayer and the impurities are selected from the group of nitrogen,molybdenum, tungsten, tantalum, indium and any combination thereof. 8.The method of claim 2, wherein the semiconductor layer is a siliconcarbide semiconductor layer and the impurities are selected from thegroup of titanium, tantalum, vanadium and any combination thereof. 9.The method of claim 2, wherein the impurities are deep impurities havinga distance to a closest bandgap of more than 100 meV.
 10. The method ofclaim 2, further comprising maintaining the impurities as recombinationcenters in a recombination zone of the semiconductor device.
 11. Themethod of claim 2, further comprising reducing a thickness of thesemiconductor substrate by removal of material of the semiconductorsubstrate prior to irradiating the semiconductor substrate with theelectromagnetic radiation configured to be absorbed by the impuritiesand configured to generate the local damage of the crystal lattice ofthe semiconductor substrate.
 12. The method of claim 11, wherein thethickness is reduced only in the part of the semiconductor substrate.13. The method of claim 2, wherein forming the semiconductor layercomprises forming a contact layer or an emitter layer on a semiconductorregion comprising the impurities, and forming a drift zone layer on thecontact layer or the emitter layer, wherein a maximum dopingconcentration of the contact layer or the emitter layer exceeds amaximum doping concentration of the drift zone layer by more than twoorders of magnitude.
 14. The method of claim 2, further comprising,after separating the semiconductor layer and the semiconductorsubstrate, forming a doped contact layer or a doped emitter layer at asurface of the semiconductor layer exposed by separating thesemiconductor layer and the semiconductor substrate.
 15. The method ofclaim 2, further comprising, prior to separating the semiconductor layerand the semiconductor substrate by thermal processing or prior toirradiating the semiconductor substrate with electromagnetic radiation,forming semiconductor device elements in and/or on the semiconductorlayer.
 16. The method of claim 2, further comprising, after separatingthe semiconductor layer and the semiconductor substrate by thermalprocessing, preparing a surface of the semiconductor substrate, exposedby separating the semiconductor layer and the semiconductor substrate,for reuse as a base substrate.
 17. The method of claim 2, furthercomprising, prior to separating the semiconductor layer and thesemiconductor substrate, mounting the semiconductor layer on a carrier.18. The method of claim 2, wherein the semiconductor device is avertical power semiconductor device, and the method further comprises:forming a first load terminal and a control terminal at a first surfaceof the semiconductor layer; and forming a second load terminal at asecond surface of the semiconductor layer opposite to the first surfaceof the semiconductor layer.
 19. The method of claim 2, furthercomprising cutting a ring structure in the semiconductor substrate froma second surface of the semiconductor substrate, and wherein thesemiconductor layer and the semiconductor substrate are separated onlywithin an inner area of the ring structure.
 20. The method of claim 19,further comprising reducing a thickness of the semiconductor substrateby removal of a material of the semiconductor substrate within the innerarea of the ring structure.
 21. The method of claim 1, wherein thesemiconductor layer includes a drift layer, the method furthercomprising: forming a semiconductor device element at least partly atthe drift layer of the semiconductor layer.
 22. The method of claim 2,wherein the semiconductor layer includes a drift layer, the methodfurther comprising: forming a semiconductor device element at leastpartly at the drift layer of the semiconductor layer.
 23. The method ofclaim 22, wherein the semiconductor device element is formed prior toseparating the semiconductor layer and the semiconductor substrate bythermal processing.
 24. The method of claim 22, wherein thesemiconductor layer includes a first surface coupled to the firstsurface of the semiconductor substrate and a second surface opposite tothe first surface of the semiconductor layer, the second surface of thesemiconductor layer being a surface of the drift layer, and thesemiconductor device element is formed at least partially at the secondsurface of the semiconductor layer.
 25. The method of claim 1, whereinthe thermal processing is applied from outside the semiconductorsubstrate and the semiconductor layer, independent of theelectromagnetic radiation, to induce a temperature change at the localdamage.
 26. The method of claim 25, wherein the thermal processingincludes a cooling process for introducing the thermo-mechanical stressto cause the crack formation.
 27. The method of claim 25, wherein thethermal processing includes a heating process for introducing thethermo-mechanical stress to cause the crack formation.
 28. The method ofclaim 2, wherein the thermal processing is applied from outside thesemiconductor substrate and the semiconductor layer, independent of theelectromagnetic radiation, to induce a temperature change at the localdamage.
 29. The method of claim 28, wherein the thermal processingincludes a cooling process for introducing the thermo-mechanical stressto cause the crack formation.
 30. The method of claim 28, wherein thethermal processing includes a heating process for introducing thethermo-mechanical stress to cause the crack formation.